Content (Syllabus outline)

  • Phenomenon of adhesion.
  • Conventional cold and hot gluing.
  • High-frequency gluing.
  • Dielectric properties of materials.
  • Innovative technologies of wood bonding.
  • Green wood gluing.
  • Welding of wood.
  • Rheology of adhesives.
  • Gelation and vitrification of adhesives, TTT.
  • Kinetics and models of curing of thermosetting adhesives.
  • Methods for monitoring adhesive cure (DSC, DMA, DEA).
  • Development of adhesive bond strength (ABES).
  • Quality of adhesive bonding.
  • Strength and energy approach for determination of adhesive bond.
  • Technology of bonding of wood with other materials (metal, polymers, glass, stone, ceramics).
  • Adhesives for bonding of wood and non-wood materials
  • Modelling and optimization of bonding process.
  • Research and development in the field of adhesive bonding.

Prerequisites

1. Pogoji za vključitev v delo:

-   vpis v ustrezni letnik študijskega programa.

 

2. Pogoji za opravljanje študijskih obveznosti:

-   udeležba na vajah. Pogoj za pristop h kolokviju je 80% prisotnost na lab. vajah.

-   opravljen kolokvij iz vaj,

-   oddano poročilo,

-   opravljene vaje,

-   predstavitev seminarske naloge.

Pogoj za pristop k izpitu so pozitivno opravljene vaje ter opravljen seminar.